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제품 상세 정보:
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| 유형: | 2U 랙 서버 | 프로세서: | 최대 2개의 3세대 Intel Xeon 확장 가능 프로세서(프로세서당 최대 40개 코어 포함) |
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| 메모리: | 32개의 DDR4 DIMM 슬롯, 최대 RDIMM 2TB 또는 최대 LRDIMM 8TB 지원, 최대 속도 3200MT/s | 급습: | PERC H745, HBA355I, S150, H355, H345, H755, H755N |
| Hdd: | 2.5" 또는 3.5" 핫스왑 NVMe, SAS, SATA 및 Near Line SAS | 라이저: | 최고 8까지 Ｘ 피코이에 Gen4 슬롯 |
| 강조하다: | Dell PowerEdge R750 server,data center server with warranty,high-performance thermal efficient server |
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The PowerEdge R750 Server is a versatile and powerful solution tailored to meet demanding enterprise needs. Equipped with advanced processing capabilities and flexible storage options, this server is designed to support high-performance workloads and growing business demands. Its robust architecture makes it an ideal choice for virtualization, databases, and enterprise applications.
The PowerEdge R750, is a full-featured enterprise server, delivering outstanding performance for the most demanding workloads.
Innovate at scale with challenging and emerging workloads
The PowerEdge R750, powered by the 3rd Generation Intel® Xeon® Scalable processors is a rack server to address application performance and acceleration. The PowerEdge R750, is a dual-socket/2U rack server that delivers outstanding performance for the most demanding workloads. It supports 8 channels of memory per CPU, and up to 32 DDR4 DIMMs @ 3200 MT/s speeds. In addition, to address substantial throughput improvements the PowerEdge R750 supports PCIe Gen 4 and up to 24 NVMe drives with improved air-cooling features and optional Direct Liquid Cooling to support increasing power and thermal requirements. This makes the PowerEdge R750 an ideal server for data center standardization on a wide range of workloads including; Database and Analytics, Highperformance computing (HPC), Traditional corporate IT, Virtual Desktop Infrastructure, and AI/ML environments that require performance, extensive storage and GPU support.
| R750 | Technical Specification | |
| Processor | Up to two 3rd Generation Intel Xeon Scalable processors, with up to 40 cores per processor | |
| Memory |
• 32 DDR4 DIMM slots, supports RDIMM 2 TB max or LRDIMM 8 TB max, speeds up to 3200 MT/s • Up to 16 Intel Persistent Memory 200 series (BPS) slots, 8 TB max • Supports registered ECC DDR4 DIMMs only |
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| Storage controllers |
• Internal controllers: PERC H745, HBA355I, S150, H345, H755, H755N
• Boot Optimized Storage Subsystem (BOSS-S2): HW RAID 2 x M.2 SSDs 240 GB or 480 GB
• Boot Optimized Storage Subsystem (BOSS-S1) HW RAID 2 x M.2 SSDs 240 GB or 480 GB
• External PERC (RAID): PERC H840, HBA355E
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| Drive Bays |
Front bays:
• Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 192 TB
• Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB
• Up to 16 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 245.76 TB
• Up to 24 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 368.84 TB
Rear bays:
• Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 30.72 TB
• Up to 4 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 61.44 TB
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| Power Supplies |
• 700 W Titanium HLAC/240 mixed mode
• 800 W Platinum AC/240 mixed mode
• 1100 W Titanium AC/240 mixed mode
• 1100 W DC -48 - -60 V
• 1400 W Platinum AC/240 mixed mode
• 1800 W Titanium HLAC/240 mixed mode
• 2400 W Platinum AC/240 mixed mode
• 2800 W Titanium HLAC/240 mixed mode
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| Fans |
• Standard fan/High performance SLVR fan/High performance GOLD fan
• Up to six hot plug fans
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| Dimensions |
• Height – 86.8 mm (3.41 inches)
• Width – 482 mm (18.97 inches)
• Depth – 758.3 mm (29.85 inches) - without bezel
772.14 mm (30.39 inches) - with bezel
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| Form Factor | 2U rack server | |
| Embedded Management |
• iDRAC9
• iDRAC Service Module
• iDRAC Direct
• Quick Sync 2 wireless module
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| Network options | 1 x OCP 3.0 (x8 PCIe lanes) | |
| Ports |
Front Ports
• 1 x Dedicated iDRAC Direct micro-USB
• 1 x USB 2.0
• 1 x VGA
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Rear Ports
• 1 x USB 2.0
• 1 x Serial (optional)
• 1 x USB 3.0
• 2 x RJ-45
• 1 x VGA (optional for liquid cooling configuration)
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| PCIe | Up to 8 x PCIe Gen4 slots (up to 6 x16) with support for SNAP I/O modules | |
The EMC™ PowerEdge™ R750 is EMC's latest 2U 2-socket designed to run complex workloads using highly scalable memory, I/O, and network options. The system features the 3rd Generation Intel® Xeon® Processor Scalable family, with up to 32 DDR4 DIMMs, up to 8 PCI Express® Gen4 enabled expansion slots, and a choice of embedded NIC technologies.
The R750 is high performance, general purpose platform that is ready to run any workload found within a customer's datacenter. The following table lists some of these workloads and the situations wherein the R750 is a good fit.
Front view of the system
Figure 1. Front view of the R750, 24x 2.5 inches Chassis
Figure 2. 24x SAS/SATA or 24x NVMe
Figure 3. 16x SAS/SATA + 8x NVMe
Figure 4. Front view of the R750, 16x 2.5 inches SAS/SATA Chassis
Figure 5. Front view of the R750, 16x 2.5 inches SAS/SATA Chassis
Figure 6. Front view of the R750, 8x 2.5 inches Chassis
Figure 7. Front view of the R750, 8x 2.5 inches Chassis
Figure 8. Front View of the R750, 12x 3.5 inches SAS/SATA Chassis
Figure 9. Front View of the R750, 12x 3.5 inches SAS/SATA Chassis
Figure 10. Rear view of the R750 with 2x 2.5 inches storage drives, 6x PCIe Gen4 slots and Hot-plug BOSS
Figure 11. Rear view of the R750 with 8x PCIe Gen4 slots and Hot-plug BOSS
Figure 12. Rear view of the R750 with 4x 2.5 inches storage drives, 4x PCIe Gen4 slot and Hot-plug BOSS
Figure 13. Inside the system of the R750
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